ON-DEMAND WEBINAR

Deep Data Quality and Reliability Monitoring of Heterogeneous Packaging

Advanced packaging solutions are a key pillar in overcoming the existing limitations of monolithic integration, which has become more difficult and expensive at each node.

 

7 - Electronics Health and Performance Monitoring from production to the Field with DataAnalytics_v4

Heterogeneous integration technologies, such as 2.5D/3D stacking, tiling, intra-die routing, through-silicon vias, chiplets and fan-out, have and significantly increased system capabilities and performance but have introduced new challenges to an industry accustomed to a “Moore’s Law inter-die scaling” approach. Quality and reliability are increasingly harder to achieve due to an inherent high density and high frequency nature, with limited visibility after assembly.

In this webinar you will learn:

  • A new concept based on deeply embedded monitors for Deep Data chip telemetry.

  • The unique combination of embedded IPs, both core and I/O, and a software platform that implements machine learning algorithms and data analytics. 

  • The ability to make data-driven decisions with better visibility from production and in-field 

  • And example of findings from a 7nm HBM ASIC controller use case will be presented.

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