Data Center Electronics
Made to Scale

Reduce power, boost performance, and ensure uptime with deep data monitoring purpose-built for hyperscale and enterprise infrastructure.​

40%
of data center costs go to energy and cooling
200M+
servers in data centers worldwide
$500K/hr
average cost of hyperscale downtime

Availability, Power, and Performance of Tomorrow’s Data Centers​

Combine on-chip monitoring with embedded applications and turn chips into system sensors.​

Hardware Reliability
Hardware ​
Reliability
Prevention of service disruption
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Power
Efficiency​
Power reduction in mission-mode​
Lower CAPEX
CAPEX
Reduction​
Hardware lifetime extension​
Supply Chain Visibility pT blue
Feedback to
Vendors​
Pinpoint root cause analysis​
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Assure Reliability, Availability, Serviceability (RAS)​

Detect, predict, and prevent faults during system operation, before they impact users.​

Prevent functional failures​

Avoid silent data corruption (SDC)​

Employ predictive maintenance​

Eliminate system-wide errors​

Explore Solutions for RAS
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Reduce Power, Increase Throughput​

Dynamically adjust power consumption and boost frequency under functional workloads, with built-in reliability assurance.​​

Increase performance-per-watt​

Extend system lifetime​

Reclaim design guard-bands​

Assure functionality with a safety net​

Explore Solutions for Power & Performance
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Advance Chip Production​

Gain in-chip visibility for SoC bring-up and test optimization, with cloud analytics and inline decisions.​

Reduce time to market

Improve quality & reliability

Reduce power, boost performance

Increase operational efficiencies

Explore Solutions for Chip Production​
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Optimize System Production​

Turn chips into system sensors for actionable insights at board and system level, to detect anomalies and ensure quality, performance and cost at product ramp and high-volume testing.​

Increase quality & reliability​

Shorten time to market​

Optimize power/performance

Accelerate root cause analysis​

Explore Solutions for System Production​
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Monitor Advanced Packaging ​

Ensure performance and reliability of chiplets, 2.5D and 3D packages with die-to-die interconnect visibility.​

Reduce time to market

Detect latent defects

Gain per-lane grading

Prevent failures

Explore Solutions for Advanced Packaging​
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WHAT OUR CUSTOMERS ARE SAYING
"Our collaboration with proteanTecs offers us a differentiated edge and enables us to bring our customer’s complex solutions to market at higher performance, at a faster pace. Mutual customers gain on-chip monitoring through the entire product lifecycle, extending all the way from production into the field."

Mohit GuptaSVP and GM, Custom Silicon and IP, Alphawave

"proteanTecs on-chip monitoring analytics adds a deeper layer of insights into our robust testing and verification program"

Kalyan MulamSVP of ASIC Engineering, Astera Labs

"proteanTecs gives us remarkable visibility into what causes units to pass or fail, as well as ways to improve everything, including the silicon, the package, the tester, the hardware, and the test program itself"

Ran SchriftDirector of Operations, Xsight Labs

"By partnering with proteanTecs, we can enable seamless integration of their on-chip monitoring agents with Neoverse CSS to further accelerate time to market"

Eddie RamirezVP of Go-to-Market, Infrastructure Line of Business, Arm

The Technology

We combine deep data from on-chip Agents with machine learning to turn system health monitoring into actionable insights - predicting faults, extending uptime, and improving reliability.

learn how it works