our solutions

Smarter Electronics Start Here​

A new class of problems needs a new class of solutions

As system complexity grows, so do the blind spots. Our solutions deliver the visibility, accuracy, and scale today’s electronics require, at every step from design to deployment.​

Saved over $5M
Cost of recall & RMA investigation
Reduced DPPM BY 502
Defective parts per million
Increased Performance 11%
Resulting in higher utilization per system

Breaking The Industry’s Silos

From chip design to system deployment,
our unified solutions bring engineering,
operations, and reliability teams together
with one source of truth.​

Deep Data

Multi-dimensional and parametric visibility

One Language

Feed-back and feed-forward correlation

At Test and In-Mission

Monitoring during production and operational lifetime

Our Solutions

Comprehensive suite of end-to-end solutions for the industry's most pressing needs.

Less Power, More Performance

Power & Performance

Optimize power efficiency and voltage margins at test and in mission mode, delivering reliable performance and extending product life across diverse workloads.​

Ensure Uptime

Reliability, Availability, Serviceability

Enhance system uptime with real-time health monitoring and predictive failure detection to proactively prevent outages and service disruptions.​

From Reaction to Prevention

Functional Safety & Diagnostics

Detect, prevent, and diagnose faults across safety-critical systems, empowering compliance and accelerating root cause analysis from silicon to system.​

accelerate production

Chip Production

Gain actionable insights into chip behavior during manufacturing - improving yield, accelerating ramp, and reducing test escapes with intelligent, guided, and design-aware analytics.​

Using chips as system sensors

System Production

Monitor real-time product behavior during board/system-level testing to catch anomalies early and improve manufacturing efficiency at scale, using cloud and on-tester analytics.​

optimize multi-chip packages

Advanced Packaging

Achieve deep visibility into 2.5D and 3D IC packages, monitoring each die and die-to-die interconnect to ensure performance and reliability at scale.​

The Technology

By applying machine learning to novel data created by on-chip monitors, the company's deep data analytics solutions deliver unparalleled visibility and actionable insights - improving power, quality and reliability.