Join us at CadenceLIVE Japan

proteanTecs has joined Cadence's Chiplet Spec-to-Packaged Parts ecosystem as the silicon analytics partner, embedding telemetry across chiplet types to help teams building for physical AI, data centers, and HPC get better visibility into what their silicon is actually doing. This event is a great opportunity to hear more about that work and see it in practice.

We are Speaking Nir Sever, Senior Director of Business Development at proteanTecs, will present, "In-Field Reliability Monitoring of Multi-Die Chiplet Architectures". This presentation will highlight an in-field analysis methodology for multi-die systems that correlates shifts in functional path timing margins, cross-die power and thermal interactions. This novel analysis approach enables predictive maintenance through adjustments in workload patterns, reallocating compute resources, changing environmental conditions and decommissioning bad cores and modules.

What we're demonstrating

◆ In-Field Continuous Performance Monitoring Continuous telemetry from inside the chip, tracking performance, degradation, and variation across the product lifecycle, not just at test time.

◆ Workload-aware Power Reduction with AVS Pro Voltage adjustment based on what the chip is actually doing at any given moment, rather than worst-case assumptions baked in at design time.

◆ Product Bring-Up with Fast TTM In-silicon visibility that helps teams debug faster and reduce the back-and-forth between silicon and software during bring-up.

If you'd like dedicated time with our team at the show, fill in the form and we'll confirm a slot that works.

🎁 Come by the booth. We'll have something for you.