Mobile & Consumer Electronics Built for All-Day Performance

Meet the power, performance, and efficiency demands of mobile and consumer devices with predictive hardware monitoring and deep silicon intelligence.

7B+
smartphones in active use worldwide
60%+
of user complaints tied to performance degradation
25%
battery capacity loss within two years

Drive Product Excellence, From Smartphones and Wearables to Always-On Edge AI

Turning CPUs, GPUs and Accelerators into intelligent self-monitoring systems for optimization and efficiency of power-constrained, application-driven workloads.

Battery Lifetime Extension
Battery Lifetime
Extension
Reduce power to increase time between charges
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Sustained
Performance
Reduce throttling for consistent performance
Thermal optimization
Thermal
Optimization
Balance power & performance under tight thermal limits
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Actionable System
Insight
Understand real-world behavior under test
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Gain Control Over Power & Performance

Dynamically optimize power consumption and performance under real mobile, consumer, and on-device AI workloads.

Extend battery life under usage

Increase throttle-free performance

Optimize performance-per-watt

Reduce temperature and thermal stress

Explore Solutions for Power & Performance
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Optimize System Production

Gain visibility of systems under functional workloads and understand software impact on silicon to improve quality, performance, and time-to-market.

Improve quality and reliability

Correlate silicon to system to software

Speed up product ramp

Accelerate root cause analysis

Explore Solutions for System Production
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Advance Chip Production

Leverage telemetry-based analytics during SoC bring-up and high-volume testing for optimized quality, power efficiency, performance, and cost.

Detect latent and marginal defects

Shorten time to market

Reduce power for each individual die

Increase operational efficiency

Explore Solutions for Chip Production
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Monitor Multi-Die Packages

Ensure performance and reliability of chiplets, 2.5D and 3D packages with in-die and interconnect visibility.

Maintain chiplet and high-bandwidth interface health

Prevent failures in mission-mode

Enable shift-left integration decisions

Dynamically reduce power of SiP

Explore Solutions for Advanced Packaging
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