The Future of Reliability Testing
Guest Speaker: Dr. Joe McPherson



The semiconductor industry is ready for the next phase in its evolution, entering the era of data. To cope with the rising uncertainties associated with advanced electronics, the fragmented nature of the industry and the limited visibility in today’s best-known-methods, a paradigm shift is needed in the fundamental approach to how data is sourced, correlated and used.  

This webinar will discuss Universal Chip Telemetry™ (UCT) for chip production, providing high coverage on-chip monitoring for parametric visibility in product bring up and volume testing.

You’ll learn:

  • How to reach volume production faster with higher confidence
  • How to achieve a 10X DPPM reduction at a fraction of the cost
  • How to shift-left production for significant cost savings

Thank You!

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