News & Events

In The News

September 5, 2022

She-inspires Interview: “If you really love what you do, don't give up. You can be a mother and have a career"

July 15, 2022

CEO Interview: Shai Cohen of proteanTecs

May 10, 2022

Israel startup preempts chip crash with machine learning, partners with TSMC and MediaTek

May 10, 2022

proteanTecs strengthens its AI-enabled chip analytics platform, raises $45M

March 15, 2022

Eye On Israeli Tech: 100 Israeli Tech Leaders You Need To Know

December 9, 2021

Frost & Sullivan Recognizes Leading Organizations with Prestigious 2021 Best Practices Awards

September 27, 2021

Porsche SE invests in Israeli startup with focus on semiconductors

August 23, 2021

Turning Datacenter Chips into System Sensors

July 19, 2021

Why on-chip telemetry is the new frontier in data center management

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Press Room

November 10, 2022

proteanTecs Hosts Webinar with Yole Group and GUC on Chiplets, Heterogeneous Integration and 2.5D/ 3D Advanced Packaging

October 26, 2022

GUC GLink™ Chip Leverages proteanTecs’ Die-to-Die Interconnect Monitoring

October 24, 2022

proteanTecs to Discuss the Future of Physical Assurance and Supply Chain Security at IEEE PAINE Conference

October 12, 2022

proteanTecs Edge™ Applications Now Available on the Advantest ACS Solution Store

September 19, 2022

proteanTecs Joins UCIe™ (Universal Chiplet Interconnect Express™) Consortium to Advance 2.5D/3D Interconnect Monitoring

August 29, 2022

Semico Research Concludes proteanTecs Deep Data Analytics Gives SoC Manufacturers a Six-Month Time-to-Market Advantage with Significant Savings

August 16, 2022

Autotalks Enhances 5G C-V2X Chipsets with proteanTecs Deep Data Analytics

July 11, 2022

proteanTecs Welcomes Anurag Mittal to Executive Team

July 6, 2022

proteanTecs to Showcase Deep Data Analytics at DAC and SEMICON West 2022

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Upcoming Events

Europe OIP Ecosystem Forum
November 8, 2022
Amsterdam, Netherlands
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ICCAD 2022
November 9, 2022
Guangzhou, China
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Teradyne Users Group - TUGx - North America Virtual Live Event
November 9, 2022
Virtual
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Webinar: The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging
November 16, 2022
Online
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China OIP Ecosystem Forum
December 6, 2022
Shanghai, China
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