News & Events

In The News

September 2, 2020

proteanTecs in Semiconductor Engineering's Startup Funding: August 2020
August 27, 2020

proteanTecs raises $45 million to apply AI to chip design and performance monitoring
June 29, 2020

proteanTecs Named One of EETimes Silicon 100: Top Startups of 2020
May 31, 2020

CTO-CTO Interview with GUC on 2.5D Package Reliability with HBM 7nm Use Case
April 26, 2020

proteanTecs Featured in Intel Capital’s “One Portfolio Company a Day” Series
February 11, 2020

proteanTecs a Category Leader in The Israeli Tech Market on TVBS News
November 28, 2019

Startup Predicts Failures in Electronics by Eyeing the Chips Inside
November 12, 2019

New Approach to Electronics Quality, Reliability, and Time-to-Market using Custom Compiler
November 5, 2019

Startup Taps AI to Monitor Chips

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Press Room

October 7, 2020

proteanTecs Announces Market and Regional Expansions
October 1, 2020

proteanTecs’ Shai Cohen Joins Virtual Panel on Automotive Reliability at the GSA European Executive Forum
September 23, 2020

proteanTecs to Present at the International Test Conference (ITC-Asia) in SEMICON Taiwan 2020
September 15, 2020

proteanTecs Granted US Patent for High Bandwidth Memory (HBM) Signal Quality and Reliability Monitoring
September 9, 2020

proteanTecs to Host Virtual Panel on Datacenter Uptime at the AI Hardware Summit
August 27, 2020

proteanTecs Closes $45M Growth Equity Round Led by Koch Disruptive Technologies (KDT)
August 11, 2020

proteanTecs to Present at SEMICON SOUTHEAST ASIA 2020
June 24, 2020

proteanTecs Joins the Global Semiconductor Alliance (GSA)
May 13, 2020

proteanTecs Announces Live Webinar on 2.5D Packaging Failure Prevention based on Deep Data Monitoring
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Upcoming Events

3D & Chiplet Test - ITC Workshop
November 6, 2020
Virtual Event
Learn More
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