The transition to chiplet-based architectures, 2.5D integration, and system-in-package (SiP) designs is reshaping how the industry delivers performance and scalability. But as systems move beyond monolithic SoCs, new challenges emerge in power delivery, thermal behavior, mechanical integrity and package-level effects which are redefining system limits. At the same time, yield and cost pressures intensify as manufacturers move from Known-Good-Die (KGD) toward more complex multi-die assembly flows, including Known-Good-Stack (KGS).

In this online webinar, industry experts discuss how design, test, and system teams are adapting to these realities with shift-left methodologies and new approaches to observability across the lifecycle. From production test constraints and compound yield to limited visibility at die boundaries and in-field reliability/power targets, experts explore how the ecosystem is evolving to ensure robust, high-performance systems.

The webinar covers:

• New Standards for Test & Test Access
• Shift-Left Observability
• Yield & Production Test Evolution
• Power & Thermal Dynamics
• Reliability Challenges