EXPERIENCE OUR TECH IN PERSONITC 2026 brings together the test and design community to confront the hardest challenges in device, board, and system testing, from design verification and DFT to in-field diagnosis, reliability, and AI-driven analytics.
ITC 2026's special tracks include Automotive Reliability, Reliability of AI Hardware, AI for Testing, 3D/2.5D & Chiplet Testing, and Hardware Security. These tracks cover the same terrain where in-silicon observability is changing what's possible.
proteanTecs experts will be attending across the week and available for one-on-one meetings. If you're working on any of these challenges, we'd welcome the chance to connect.
Let's talk about how proteanTecs can help:
◆ In-Field Continuous Monitoring Real-time telemetry from inside the chip, tracking performance and degradation across the product lifecycle.
◆ AI Hardware Reliability As AI chips push voltage, power, and thermal limits, in-silicon observability becomes the foundation for reliability and field performance.
◆ 3D/2.5D & Chiplet Testing Advanced packaging introduces new observability challenges across die-to-die interfaces, HBM, and multi-die stacks.
◆ Workload-Aware Power Reduction with AVS Pro Voltage scaling based on what the chip is actually doing, rather than worst-case assumptions baked in at design time.
◆ Fast Bring-Up & Time to Market In-silicon visibility during product bring-up helps teams debug faster, reduce iteration cycles, and reach production without leaving yield on the table.
◆ AI for Test & Analytics This is exactly where proteanTecs operates, using silicon data to drive smarter decisions across the test and product lifecycle.
We'd welcome the opportunity to connect in person. Complete the form to schedule 1:1 time while at the show.
