EXPERIENCE OUR TECH IN PERSONITC 2026 brings together the test and design community to confront the hardest challenges in device, board, and system testing, from design verification and DFT to in-field diagnosis, reliability, and AI-driven analytics.
ITC 2026's special tracks include Automotive Reliability, Reliability of AI Hardware, AI for Testing, 3D/2.5D & Chiplet Testing, and Hardware Security. These tracks cover the same terrain where in-silicon observability is changing what's possible.
WORKSHOP SESSION
16 October | 1:00 - 2:15 PM
From Known-Good Die to Known-Good System: In-Die Telemetry and AI-Based Analytics for Advanced Packaging
Presenters:
Noam Brousard, VP Solutions Engineering
This presentation introduces an approach that combines deep in-die telemetry with AI-based software for health and performance management of multi-die packages.
We’d welcome the chance to meet in person and discuss how proteanTecs’ in-silicon telemetry and AI-driven analytics help improve reliability, optimize power, streamline testing, and accelerate time to market across the semiconductor lifecycle. Learn about:
◆ 3D/2.5D and Chiplet Testing: Gain visibility across interfaces, HBM and multi-die systems.
◆ Continuous In-Field Monitoring: Track chip performance and degradation throughout its lifetime.
◆ Workload-Aware Power Reduction: AVS Pro dynamically scales voltage based on real workloads.
Complete the form to schedule 1:1 time while at the show.
