Telecom Electronics Built for Always-On Networks​

Meet carrier-grade availability and performance demands with predictive
hardware monitoring and
diagnostics across distributed infrastructure.​

300M+
mobile base stations worldwide
99.9%
expected uptime for carrier services
250 TWh
global power consumption per year

Reliability, Efficiency, and Visibility for Next-Gen RAN, Edge, and Core Systems​

Turning chips into system sensors for in-mission, ML-driven monitoring.

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Predictive
Maintenance​
From time-based to health-based service​
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Increased
Reliability​
Continuous failure prevention monitoring​
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Power
Efficiency​
Increased performance-per-watt per node​
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Remote
Diagnostics​
Send back data, not systems​
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Assure Reliability, Availability, Serviceability (RAS)

Detect, predict, and prevent hardware failures in live telecom networks before they impact service and subscribers.​

Prevent service disruptions

Enable predictive maintenance​

Catch faults before outages​

Employ remote diagnostics​

Reduce Power, Increase Network Throughput​

Optimize performance-per-watt in always-on telecom equipment under real traffic and environmental conditions.​

Increase performance-per-watt​

Reduce energy consumption​

Reclaim design guard-bands​

Extend system lifetime​

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Webinar

Intelligent Networks: Power, Reliability & Maintenance in Telecom

Panel of industry experts from Nokia, HPE, Arm, and proteanTecs exploring the complexities of designing, deploying, and maintaining the next-generation telecom network infrastructure.

Optimize System Production

Turn SoCs into intelligent system sensors to improve quality, performance and deployment at scale.​

Improve quality and reliability​

Accelerate validation and deployment​

Monitor functional workload stress​

Accelerate root cause analysis​

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Advance Chip Production

Gain in-chip visibility to optimize silicon for demanding telecom workloads from bring-up to volume production.

Reduce time to market​

Optimize power & performance​

Increase quality and reliability​

Optimize designs for real-world conditions​

Monitor Advanced Packaging

Ensure reliability and performance of advanced 2.5D and 3D packages used in high-performance, mission-critical environments.​

Detect latent defects​

Shift-left decisions

Prevent failures from interconnect and thermal stress​

Monitor heterogeneous integration​

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Hear from our clients
"By partnering with proteanTecs, we can enable seamless integration of their on-chip monitoring agents with Neoverse CSS to further accelerate time to market"

Eddie RamirezVP of Go-to-Market, Infrastructure Line of Business, Arm

"proteanTecs' deep data insights will empower our mutual customers to optimize their designs, improve their power/performance envelope, proactively prevent faults, and deliver superior products faster."

Dr. Charlie SuCTO and President, Andes Technology

"proteanTecs gives us remarkable visibility into what causes units to pass or fail, as well as ways to improve everything, including the silicon, the package, the tester, the hardware, and the test program itself"

Ran SchriftDirector of Operations, Xsight Labs

"proteanTecs on-chip monitoring analytics adds a deeper layer of insights into our robust testing and verification program"

Kalyan MulamSVP of ASIC Engineering, Astera Labs