Join us at CadenceLIVE Japan

proteanTecs has joined Cadence's Chiplet Spec-to-Packaged Parts ecosystem as the silicon analytics partner, embedding telemetry across chiplet types to help teams building for physical AI, data centers, and HPC get better visibility into what their silicon is actually doing. This event is a great opportunity to hear more about that work and see it in practice.

What we're demonstrating

◆ In-Field Continuous Performance Monitoring Continuous telemetry from inside the chip, tracking performance, degradation, and variation across the product lifecycle, not just at test time.

◆ Workload-aware Power Reduction with AVS Pro Voltage adjustment based on what the chip is actually doing at any given moment, rather than worst-case assumptions baked in at design time.

◆ Product Bring-Up with Fast TTM In-silicon visibility that helps teams debug faster and reduce the back-and-forth between silicon and software during bring-up.

Our collaboration with Cadence proteanTecs is part of Cadence's chiplet ecosystem, contributing silicon analytics to a platform designed to take customers from spec to packaged parts with less engineering overhead. If you're working on chiplet-based designs for automotive, AI compute, or advanced SoCs, there's a relevant conversation to be had.

If you'd like dedicated time with our team at the show, fill in the form and we'll confirm a slot that works.

🎁 Come by the booth. We'll have something for you.