EXPERIENCE OUR TECH IN PERSONproteanTecs has joined Cadence's Chiplet Spec-to-Packaged Parts ecosystem as the silicon analytics partner, embedding telemetry across chiplet types to help teams building for physical AI, data centers, and HPC get better visibility into what their silicon is actually doing. This event is a great opportunity to hear more about that work and see it in practice.
What we're presenting:
From Known Good Die to Known Good System with Parametric Grading: This talk introduces a production characterization framework that applies fine‑grained parametric methods to assess each die, and each assembled configuration. By capturing path margin signatures across dies, for performance and susceptibility to degradation, and evaluating the interaction of power domains across the final system, this framework supports mix‑and‑match screening with significantly higher resolution than binary pass or fail outcomes. It enables identification of marginal chiplets that would otherwise pass conventional tests, , and classification of die combinations that introduce emergent behaviors not visible at wafer test.
Our collaboration with Cadence proteanTecs is part of Cadence's chiplet ecosystem, contributing silicon analytics to a platform designed to take customers from spec to packaged parts with less engineering overhead. If you're working on chiplet-based designs for automotive, AI compute, or advanced SoCs, there's a relevant conversation to be had.
👉If you'd like dedicated time with our team at the show, fill in the form and we'll confirm a slot that works.
