This white paper presents how proteanTecs’ monitoring technology improves HBM subsystem reliability in advanced heterogeneous packaging through deep data analytics and enhanced silicon visibility. It describes the monitoring concept and demonstrates results from a GUC 7nm HBM Controller ASIC integrated with Samsung Aquabolt HBM memory.

In CoWoS-based designs, hundreds of thousands of micro-bumps (u-bumps) connect dies through the interposer. While many signals typically include multiple u-bumps for redundancy, HBM PHY interfaces rely on a single u-bump per signal due to extremely dense routing. As a result, a single defect can cause subsystem or system failure—creating significant risk during manufacturing test and during field operation. proteanTecs enables improved reliability monitoring and early detection of such issues, helping mitigate yield loss and operational downtime.

This white paper covers:

• The reliability challenges of HBM subsystems in advanced packaging, including single-point failures in high-density micro-bump connections.
• How proteanTecs monitoring technology provides deep visibility and analytics to detect, monitor, and repair reliability risks.
• Silicon results from a GUC EX0010A 7nm test chip with Samsung Aquabolt HBM, evaluated using worst-case interposer routing at 2.4 Gbps and 3.2 Gbps.