As demand grows for high-performance systems in applications such as Automotive, AI/ML, and 5G, the semiconductor industry is increasingly turning to “More than Moore” approaches like heterogeneous integration and System-in-Package (SiP). These architectures rely on high-performance die-to-die interconnects—often ultra-wide parallel interfaces—to deliver bandwidth and efficiency. However, advanced packaging introduces new reliability and test challenges, including latent defects and limited post-assembly visibility. This white paper explores how GUC’s GLink™ die-to-die interface, combined with proteanTecs chip telemetry and analytics, enables comprehensive monitoring and characterization of high-bandwidth D2D links in advanced packaging.

This white paper covers:

• The role of parallel die-to-die interconnects such as GUC’s GLink™ in enabling high-bandwidth heterogeneous integration.
• Reliability and test challenges in advanced packaging, including micro-bump defects and bridge shorts.
• How proteanTecs’ telemetry-based monitoring technology provides full visibility and analytics for D2D interfaces, demonstrated on a 5nm GLink™ test chip.

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