Join us at Design Solution Forum

proteanTecs has joined the Design Solution Forum

We are speaking Ziv Paz VP Business Development at proteanTecs, will present, "In-Field Reliability Monitoring of Multi-Die Chiplet Architectures". This presentation will highlight an in-field analysis methodology for multi-die systems that correlates shifts in functional path timing margins, cross-die power and thermal interactions. This novel analysis approach enables predictive maintenance through adjustments in workload patterns, reallocating compute resources, changing environmental conditions and decommissioning bad cores and modules.

What we're demonstrating

◆ In-Field Continuous Performance Monitoring Continuous telemetry from inside the chip, tracking performance, degradation, and variation across the product lifecycle, not just at test time.

◆ Workload-aware Power Reduction with AVS Pro Voltage adjustment based on what the chip is actually doing at any given moment, rather than worst-case assumptions baked in at design time.

◆ Product Bring-Up with Fast TTM In-silicon visibility that helps teams debug faster and reduce the back-and-forth between silicon and software during bring-up.

If you'd like dedicated time with our team at the show, fill in the form and we'll confirm a slot that works.

🎁 Come by the booth. We'll have something for you.